Heat transfer in subcooled pool boiling on nano-textured surfaces is reported in this study. Silicon wafers coated with Multiwalled Carbon Nanotubes (MWCNT) forests 9 microns (Type-A), and 25 microns (Type-B) in height and 8–15 nm in diameter with a randomized pitch of 16–30 nm, form the test surfaces. The test fluid is a fluoroinert (PF-5060, Manufacturer: 3M Co.) with a boiling point of 56°C. The test rig is of the constant heat flux type. Heat transfer enhancement of approximately 1.3 to 32% is observed in the nucleate boiling regime for Type-A at subcooling levels of 20°C. Type-B CNT shows an enhancement of about 13–30% in the nucleate boiling regime for 20°C subcooling. Digital images acquired during the tests show increased nucleation occurring on surfaces coated with MWCNT. Potential factors that could explain the observed heat transfer enhancement are: the enhanced surface area (nano-fin effect), disruption of the “microlayer” region in nucleate boiling, an increase in the size of cold-spots and the high thermal conductivity of MWCNT.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4278-9
PROCEEDINGS PAPER
Subcooled Pool Boiling Studies on Nano-Textured Surfaces
Vijaykumar Sathyamurthi,
Vijaykumar Sathyamurthi
Texas A&M University, College Station, TX
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Debjyoti Banerjee
Debjyoti Banerjee
Texas A&M University, College Station, TX
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Vijaykumar Sathyamurthi
Texas A&M University, College Station, TX
Debjyoti Banerjee
Texas A&M University, College Station, TX
Paper No:
IPACK2007-33069, pp. 985-991; 7 pages
Published Online:
January 8, 2010
Citation
Sathyamurthi, V, & Banerjee, D. "Subcooled Pool Boiling Studies on Nano-Textured Surfaces." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 985-991. ASME. https://doi.org/10.1115/IPACK2007-33069
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