In molding, geometric variation of molded parts is inevitable since the parts have a thermal history, including expansion and shrinkage, during the molding process. Shrinkage induces variation between the designed dimensions and locations of features on molded parts while the parts are cooled. Characterization of the variation is necessary to ensure dimensional and location integrity. Hot embossing and injection molding were performed in order to assess variation. Measurements were made using a Measurescope (MM-22, Nikon Corp., Kawasaki, Japan). The measured locations and dimensions were compared to estimates obtained using a simple model based on the linear thermal expansion coefficients (CTE) of the molded materials. The measured and the estimated shrinkage from hot embossing were incorporated in the fabrication of microtiter plate-based polymer microfluidic platforms.
- Electronic and Photonic Packaging Division
Dimensional and Locational Integrity in the Replication of Polymeric Microdevices
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You, BH, Park, DS, Chen, P, Caceres, WM, Nikitopoulos, DE, Soper, SA, & Murphy, MC. "Dimensional and Locational Integrity in the Replication of Polymeric Microdevices." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 955-959. ASME. https://doi.org/10.1115/IPACK2007-33482
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