Successful commercialization of flexible organic electronic devices is largely dependent on proper encapsulation that protects them from permeation of oxygen and water vapor. At present, low permeation encapsulation materials generally consist of multilayer films of organic/inorganic materials which can be deposited by plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), and vapor phase deposition. For this study, we report the effective water vapor transmission rates (WVTR) for multilayer thin films consisting of low temperature PECVD deposited SiNx and SiOx combined with a parylene organic layer. The effective WVTR was measured as a function of the number of bilayer pairs using Ca corrosion tests. The effective WVTR at 20 °C and 50% relative humidity [RH] for three bilayer pairs of SiOx/parylene ranged between 4.4–8.0 × 10−4 g/m2/day while SiNx/parylene had a transmission rate 1.3×10−4 g/m2/day. In general, additional layers were found to decrease the permeation rates to as low as 3.9×10−5 g/m2/day, while the SiNx/parylene coatings performed the best overall.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4278-9
PROCEEDINGS PAPER
Fabrication and Characterization of SiOx/Parylene and SiNx/Parylene Thin Film Encapsulation Layers Available to Purchase
Namsu Kim,
Namsu Kim
Georgia Institute of Technology, Atlanta, GA
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Seunghyup Yoo,
Seunghyup Yoo
Georgia Institute of Technology, Atlanta, GA
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William Potscavage,
William Potscavage
Georgia Institute of Technology, Atlanta, GA
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Benoit Domercq,
Benoit Domercq
Georgia Institute of Technology, Atlanta, GA
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Bernard Kippelen,
Bernard Kippelen
Georgia Institute of Technology, Atlanta, GA
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Samuel Graham
Samuel Graham
Georgia Institute of Technology, Atlanta, GA
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Namsu Kim
Georgia Institute of Technology, Atlanta, GA
Seunghyup Yoo
Georgia Institute of Technology, Atlanta, GA
William Potscavage
Georgia Institute of Technology, Atlanta, GA
Benoit Domercq
Georgia Institute of Technology, Atlanta, GA
Bernard Kippelen
Georgia Institute of Technology, Atlanta, GA
Samuel Graham
Georgia Institute of Technology, Atlanta, GA
Paper No:
IPACK2007-33332, pp. 933-938; 6 pages
Published Online:
January 8, 2010
Citation
Kim, N, Yoo, S, Potscavage, W, Domercq, B, Kippelen, B, & Graham, S. "Fabrication and Characterization of SiOx/Parylene and SiNx/Parylene Thin Film Encapsulation Layers." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 933-938. ASME. https://doi.org/10.1115/IPACK2007-33332
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