The recent development of electric and electronic devices has been remarkable. The miniaturization of electronic devices and high integration are progressing by advances in mounting technology. As a result, the reliability of fatigue life has been prioritized as an important concern, since the thermal expansion difference between a package and printed circuit board causes thermal fatigue. It is demanded a long-life product which has short development time. However, it is difficult because of the interaction between each design factor. The authors have investigated the influence of design factors on the reliability of soldered joints in BGA model by using response surface method and cluster analysis. By using these methods, the interaction of all design factors was clarified. Based upon these analytical results, design engineers can rate each factor’s effect on reliability and assess the reliability of their basic design plan at the concept design stage.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4278-9
PROCEEDINGS PAPER
Evaluation Method of Interaction Relation Between Design Factors and Simple Assessment Approach for BGA Package Reliability
Satoshi Kondo,
Satoshi Kondo
Yokohama National University, Yokohama, Kanagawa, Japan
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Qiang Yu,
Qiang Yu
Yokohama National University, Yokohama, Kanagawa, Japan
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Tadahiro Shibutani,
Tadahiro Shibutani
Yokohama National University, Yokohama, Kanagawa, Japan
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Masaki Shiratori
Masaki Shiratori
Yokohama National University, Yokohama, Kanagawa, Japan
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Satoshi Kondo
Yokohama National University, Yokohama, Kanagawa, Japan
Qiang Yu
Yokohama National University, Yokohama, Kanagawa, Japan
Tadahiro Shibutani
Yokohama National University, Yokohama, Kanagawa, Japan
Masaki Shiratori
Yokohama National University, Yokohama, Kanagawa, Japan
Paper No:
IPACK2007-33242, pp. 855-861; 7 pages
Published Online:
January 8, 2010
Citation
Kondo, S, Yu, Q, Shibutani, T, & Shiratori, M. "Evaluation Method of Interaction Relation Between Design Factors and Simple Assessment Approach for BGA Package Reliability." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 855-861. ASME. https://doi.org/10.1115/IPACK2007-33242
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