To design a high-speed/frequency system, the dielectric material properties, i.e., dielectric constant and loss tangent are key inputs and their frequency and temperature dependency need to be “in situ” comprehended accurately, since important high-speed quantities, such as characteristic impedance, propagation constant and S-parameters, depend upon the physical dimensions and dielectric material properties of transmission line. This paper investigates frequency and temperature dependent properties of dielectric materials used for high performance microelectronic substrate up to 40 GHz under −40 to 200 deg C, with a general-purpose vector network analyzer (VNA) for obtaining S-parameter of “in situ” test coupons fabricated utilizing the actual process technology. Based on this “in situ” measurement, impact of the frequency and temperature dependent dielectric material properties on the high-speed quantities also have been discussed.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4278-9
PROCEEDINGS PAPER
In-Situ Evaluation of High Frequency and High Temperature Characteristics of Dielectric in High-Density Substrate
Youhong Wu,
Youhong Wu
IBIDEN Company, Ltd., Ibigawa, Gifu, Japan
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Shinobu Kato,
Shinobu Kato
IBIDEN Company, Ltd., Ibigawa, Gifu, Japan
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DongDong Wang,
DongDong Wang
IBIDEN U.S.A. R&D Inc., Torrance, CA
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Toshimasa Matsuoka,
Toshimasa Matsuoka
Osaka University, Suita, Osaka, Japan
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Kenji Taniguchi
Kenji Taniguchi
Osaka University, Suita, Osaka, Japan
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Youhong Wu
IBIDEN Company, Ltd., Ibigawa, Gifu, Japan
Shinobu Kato
IBIDEN Company, Ltd., Ibigawa, Gifu, Japan
DongDong Wang
IBIDEN U.S.A. R&D Inc., Torrance, CA
Toshimasa Matsuoka
Osaka University, Suita, Osaka, Japan
Kenji Taniguchi
Osaka University, Suita, Osaka, Japan
Paper No:
IPACK2007-33148, pp. 725-728; 4 pages
Published Online:
January 8, 2010
Citation
Wu, Y, Kato, S, Wang, D, Matsuoka, T, & Taniguchi, K. "In-Situ Evaluation of High Frequency and High Temperature Characteristics of Dielectric in High-Density Substrate." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 725-728. ASME. https://doi.org/10.1115/IPACK2007-33148
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