This paper presents the results of an experimental study of steady state heat conduction in a three dimensional stack package. The temperatures are measured at different interfaces within the stacked package. Delphi devices are used in the experiment which enables controlled power input and surface temperature of the devices. The experiment is carried out for three different boundary conditions on the package. The power input in varied to study its effects. A numerical model is created to compare to the experimental results. The results are also compared with the analytical solution presented in Desai et al [5] and Geer et al [6]. The results indicate that the experimental, numerical and analytical solutions follow the same trend. The agreement between the experimental and numerical results improves when the lateral losses are taken into account.
Skip Nav Destination
ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4278-9
PROCEEDINGS PAPER
Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package Available to Purchase
Anand Desai,
Anand Desai
Binghamton University, Binghamton, NY
Search for other works by this author on:
James Geer,
James Geer
Binghamton University, Binghamton, NY
Search for other works by this author on:
Bahgat Sammakia
Bahgat Sammakia
Binghamton University, Binghamton, NY
Search for other works by this author on:
Anand Desai
Binghamton University, Binghamton, NY
James Geer
Binghamton University, Binghamton, NY
Bahgat Sammakia
Binghamton University, Binghamton, NY
Paper No:
IPACK2007-33045, pp. 617-623; 7 pages
Published Online:
January 8, 2010
Citation
Desai, A, Geer, J, & Sammakia, B. "Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 617-623. ASME. https://doi.org/10.1115/IPACK2007-33045
Download citation file:
7
Views
Related Proceedings Papers
Related Articles
An Efficient Localized Radial Basis Function Meshless Method for Fluid Flow and Conjugate Heat Transfer
J. Heat Transfer (February,2007)
General Solution for Mechanical and Thermal Stresses in a Functionally Graded Hollow Cylinder due to Nonaxisymmetric Steady-State Loads
J. Appl. Mech (January,2003)
Heat Conduction in a Rectangular Tube With Eccentric Hot Spots
J. Thermal Sci. Eng. Appl (December,2011)
Related Chapters
Introduction
Introduction to Finite Element, Boundary Element, and Meshless Methods: With Applications to Heat Transfer and Fluid Flow
Energy Balance for a Swimming Pool
Electromagnetic Waves and Heat Transfer: Sensitivites to Governing Variables in Everyday Life
Conclusion
Introduction to Finite Element, Boundary Element, and Meshless Methods: With Applications to Heat Transfer and Fluid Flow