A numerical study is performed to investigate unsteady, two-dimensional, incompressible laminar flow over both sides of a slot-perforated flat surface in a pulsating channel flow. Enhances is placed on the effects of the pulsating Strouhal number, the Reynolds number Re, the blockage factor, i.e., the ratio of plate thickness, d, to channel width, W, on the heat transfer performance and the velocity and thermal fields. It is found from the study that: (i) when the fluid stream is pulsated, the alternating change in the fluid flow disturbs the thermal boundary layer formed along the plate and induces mixing of the upper and lower streams of the plate downstream from the slot, resulting in an amplification of heat-transfer performance; (ii) heat transfer performance at the rear plate is induced with Re; (iii) by contrast, heat transfer performance is attenuated with an increase in the blockage factor, whose effect becomes larger in the lower region of the Reynolds number; and (iv) heat transfer performance is intensified with an increase in fSr, whose effect becomes minor in the lower region of the Reynolds number.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4278-9
PROCEEDINGS PAPER
Thermal Fluid Flow Transport Phenomena in a Channel Containing Slot-Perforated Flat Plates
Shuichi Torii,
Shuichi Torii
Kumamoto University, Kumamoto, Kumamoto, Japan
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Wen Jei Yang
Wen Jei Yang
University of Michigan, Ann Arbor, MI
Search for other works by this author on:
Shuichi Torii
Kumamoto University, Kumamoto, Kumamoto, Japan
Wen Jei Yang
University of Michigan, Ann Arbor, MI
Paper No:
IPACK2007-33054, pp. 547-554; 8 pages
Published Online:
January 8, 2010
Citation
Torii, S, & Yang, WJ. "Thermal Fluid Flow Transport Phenomena in a Channel Containing Slot-Perforated Flat Plates." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 547-554. ASME. https://doi.org/10.1115/IPACK2007-33054
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