The paper describes a novel approach for achieving enhanced energy efficiency for computer servers. The paper teaches a novel solid-state technique and apparatus for recycling waste heat from chip packages and turning that wasted energy into hot-spot cooling for other IC packages in the same server. This approach brings the combined advantages of enhanced energy efficiency while smoothing out the spatial and temporal thermal gradients, thereby yielding better long term reliability for multiple-chip enterprise servers.
Volume Subject Area:
Solid State Power Generation and Cooling for Electronic Packaging and Systems
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