An annular-geometry thermoelectric module (TEM) operating in refrigeration mode is analyzed. As in conventional (Cartesian geometry) TEMs, the pellets are interconnected such that current flows through them in series whilst they act in parallel with respect to conduction heat transfer. Current direction is such that Peltier cooling is provided at the inner radius of an annular TEM and heat dissipation is at its outer radius, where a boundary condition of the first kind is imposed. The cross-sectional area of each pellet increases linearly with radius. Accounting for electrical contact resistances at the interconnects, the necessary (one-dimensional) heat-conduction problem is solved to determine general expressions for the cooling rate provided by and coefficient performance of an annular TEM. Maximum cooling flux into an annular TEM and coefficient of performance for cooling fluxes below the maximum value are calculated and compared to those for conventional TEMs. Finally, the benefits of using an annular-geometry TEM are discussed.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4278-9
PROCEEDINGS PAPER
Analysis of an Annular-Geometry Thermoelectric Module (TEM)
Shankar Krishnan,
Shankar Krishnan
Bell Laboratories Ireland, Dublin, Ireland
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Marc Hodes,
Marc Hodes
Bell Laboratories Ireland, Dublin, Ireland
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Christopher Jones,
Christopher Jones
Bell Laboratories, Murray Hill, NJ
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Oana Malis
Oana Malis
Bell Laboratories, Murray Hill, NJ
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Shankar Krishnan
Bell Laboratories Ireland, Dublin, Ireland
Marc Hodes
Bell Laboratories Ireland, Dublin, Ireland
Christopher Jones
Bell Laboratories, Murray Hill, NJ
Oana Malis
Bell Laboratories, Murray Hill, NJ
Paper No:
IPACK2007-33763, pp. 241-247; 7 pages
Published Online:
January 8, 2010
Citation
Krishnan, S, Hodes, M, Jones, C, & Malis, O. "Analysis of an Annular-Geometry Thermoelectric Module (TEM)." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 241-247. ASME. https://doi.org/10.1115/IPACK2007-33763
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