A series of experimental studies on the heat transfer characteristics from heat sinks or Heat Sink/TEC assemblies in a ducted flow have been performed. Their effects on heat transfer characteristics in ducted flow have been systematically explored. From the results, new performance correlations of the temperature difference (ΔT) and terminal voltage (V) of the TEC modules are proposed. Besides, two new correlations of steady-state average Nusselt number and external thermal resistance in terms of relevant influencing parameters for confined ppf heat sinks in a ducted flow are also proposed, respectively. The statistical sensitivity analysis of ANOVA F-test is employed to estimate the contributions of relevant parameters. Furthermore, a series of RSM models for evaluating heat transfer characteristics including average Nusselt number, average external thermal resistance and Tc−Ta are established. A Sequential Quadratic Programming with multi-starting-point method is successfully employed to automatically and efficiently seek a globally optimal thermal performance. An optimal design of HS/TEC assemblies under both COP ≥ 2 and pumping power limitation larger than 30 W can be achieved with a reduction of 75% on thermal resistance.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4278-9
PROCEEDINGS PAPER
Thermal Optimal Design for Heat Sinks or Heat Sink/TEC Assemblies in a Ducted Flow
T. Y. Wu,
T. Y. Wu
National Tsing Hua University, Hsinchu, Taiwan
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M. C. Wu,
M. C. Wu
National Tsing Hua University, Hsinchu, Taiwan
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J. T. Horng,
J. T. Horng
National Tsing Hua University, Hsinchu, Taiwan
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S. F. Chang,
S. F. Chang
National Tsing Hua University, Hsinchu, Taiwan
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P. L. Chen,
P. L. Chen
National Tsing Hua University, Hsinchu, Taiwan
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Y. H. Hung
Y. H. Hung
National Tsing Hua University, Hsinchu, Taiwan
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T. Y. Wu
National Tsing Hua University, Hsinchu, Taiwan
M. C. Wu
National Tsing Hua University, Hsinchu, Taiwan
J. T. Horng
National Tsing Hua University, Hsinchu, Taiwan
S. F. Chang
National Tsing Hua University, Hsinchu, Taiwan
P. L. Chen
National Tsing Hua University, Hsinchu, Taiwan
Y. H. Hung
National Tsing Hua University, Hsinchu, Taiwan
Paper No:
IPACK2007-33285, pp. 213-220; 8 pages
Published Online:
January 8, 2010
Citation
Wu, TY, Wu, MC, Horng, JT, Chang, SF, Chen, PL, & Hung, YH. "Thermal Optimal Design for Heat Sinks or Heat Sink/TEC Assemblies in a Ducted Flow." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 213-220. ASME. https://doi.org/10.1115/IPACK2007-33285
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