It is always a challenge to deal with dynamic loads. Often, attempts are made to compare the peak acceleration of the shock load. However, the peak acceleration is the maximum acceleration at one frequency. It may not be the most damaging load for the electronics with a different resonant frequency. This paper is to propose a mathematical method to calculate printed circuit board deflections under shock load. The theory is the printed circuit board will deflect the most at its resonance point when there are dynamic excitations. This paper also discusses a method to use load factor or equivalent acceleration load to calculate printed circuit board deflections under dynamic loads.
- Electronic and Photonic Packaging Division
Study of Printed Circuit Board Shock Transmissibility
Wang, FF. "Study of Printed Circuit Board Shock Transmissibility." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 151-155. ASME. https://doi.org/10.1115/IPACK2007-33074
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