A crack with unusual failure mode after thermal shock test (TST) is observed on the die bulk of certain bare-die FCBGA, in which the crack penetrates longitudinally within silicon die region. The computational fluid dynamics (CFD) method is introduced to investigate this phenomenon. The transient analysis results indicate a significant temperature difference existing between top and bottom surfaces of the silicon die in the very beginning of the liquid-to-liquid temperature transition. This could be fatal to a brittle material like silicon. Some possible solutions are then surveyed to alleviate the thermal impact to the FCBGA. At least one of enhanced proposals is proved effective to eliminate die crack occurrence after TST.

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