In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic phase; at a much smaller length scale the eutectic phase consists of submicron size Ag3Sn particles embedded in a homogeneous Sn matrix. The model predictions agree well with creep test data of RE doped SnAg solders.
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A Multiscale Modeling Method for the Creep Behavior of SnAg Solder Alloys
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Pei, M, & Qu, J. "A Multiscale Modeling Method for the Creep Behavior of SnAg Solder Alloys." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 115-120. ASME. https://doi.org/10.1115/IPACK2007-33703
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