This paper proposes a method which can estimate essential material constants of an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading which repeats instantaneous straining and strain maintaining. The time-independent strains can be evaluated by using the stress-strain relations at the instantaneous straining parts, while the time-dependent strain can be evaluated by using the stress-time relations during the strain maintaining parts. Based on the results of the evaluations, the material constants of the elasto-plastic-creep models are estimated. Simulations of the viscoplastic deformations of Sn-3.0Ag-0.5Cu solder alloy were also conducted to verify the validity of the proposed method.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4278-9
PROCEEDINGS PAPER
Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
Ken-Ichi Ohguchi,
Ken-Ichi Ohguchi
Akita University, Akita, Akita, Japan
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Katsuhiko Sasaki,
Katsuhiko Sasaki
Hokkaido University, Sapporo, Hokkaido, Japan
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Setsuo Aso
Setsuo Aso
Akita University, Akita, Akita, Japan
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Ken-Ichi Ohguchi
Akita University, Akita, Akita, Japan
Katsuhiko Sasaki
Hokkaido University, Sapporo, Hokkaido, Japan
Setsuo Aso
Akita University, Akita, Akita, Japan
Paper No:
IPACK2007-33663, pp. 107-113; 7 pages
Published Online:
January 8, 2010
Citation
Ohguchi, K, Sasaki, K, & Aso, S. "Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 107-113. ASME. https://doi.org/10.1115/IPACK2007-33663
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