The challenges on the present thermal management devices of the present and future generation will be identified. The expected power roadmap will be revealed for high end processors. The different types of thermal management techniques will be disclosed as a function of the heat flux from the processors. In addition, the anticipated thermal resistance for thermal management devices for CPU&GPU will be presented. Attention will be focused on the order of magnitude for the different thermal resistance elements will also be identified.
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Thermal Challenges in the Present and Next Generation of PC Processors
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Refai-Ahmed, G. "Thermal Challenges in the Present and Next Generation of PC Processors." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 1029-1032. ASME. https://doi.org/10.1115/IPACK2007-33506
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