The introduction of new products to the manufacturing environment is a challenging task. The extent of this challenge varies depending on the complexity of the product being introduced. Fully Buffered Dual In-line Memory Modules (FBDIMMs), which have been a recent introduction to the memory industry, pose several unique challenges that need to be addressed. The objective of this study was to first comprehend the distinguishing features of this product against a generic memory module from an assembly process perspective and address the associated issues. Failure Modes and Effects Analysis (FMEA) was conducted to highlight the areas of concern from a process and reliability stand point. Processes were developed to mitigate the occurrence and severity rate of the identified failure modes. The assembly of heat sinks on these modules is a unique aspect and required special tools and fixtures. Various issues that were critical to quality were encountered while assembling the heat sinks. Centering of heat sinks over the module after assembly was also observed to be critical. Misaligned heat sinks can obstruct the insertion of modules into test and application sockets. A special tool was designed to address this issue. Upon installation of the new tool, a capability study was performed to validate the process. Removal of the heat sink for component rework purposes was also a concern. This was mainly due to the adhesion of the Thermal Interface Material (TIM) material used on the heat sink with the components on the board. The adhesion led to component separation from the board during the removal process and required a special process to mitigate this issue. The methods used to address these issues are reported. The product reliability was validated using thermal cycling, shock and vibration tests. The results of these tests are also reported in the paper.
Skip Nav Destination
ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4277-0
PROCEEDINGS PAPER
New Product Introduction of Fully Buffered DIMM: A Process Perspective
Gurudutt Chennagiri,
Gurudutt Chennagiri
State University of New York - Binghamton, Binghamton, NY
Search for other works by this author on:
Satyanarayan Iyer,
Satyanarayan Iyer
Smart Modular Technologies, Inc., Fremont, CA
Search for other works by this author on:
Pei-Fang Tsai,
Pei-Fang Tsai
State University of New York - Binghamton, Binghamton, NY
Search for other works by this author on:
Krishnaswami Srihari
Krishnaswami Srihari
State University of New York - Binghamton, Binghamton, NY
Search for other works by this author on:
Gurudutt Chennagiri
State University of New York - Binghamton, Binghamton, NY
Satyanarayan Iyer
Smart Modular Technologies, Inc., Fremont, CA
Pei-Fang Tsai
State University of New York - Binghamton, Binghamton, NY
Krishnaswami Srihari
State University of New York - Binghamton, Binghamton, NY
Paper No:
IPACK2007-33678, pp. 917-922; 6 pages
Published Online:
January 8, 2010
Citation
Chennagiri, G, Iyer, S, Tsai, P, & Srihari, K. "New Product Introduction of Fully Buffered DIMM: A Process Perspective." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 917-922. ASME. https://doi.org/10.1115/IPACK2007-33678
Download citation file:
9
Views
Related Proceedings Papers
Related Articles
A FMEA Optimization Method Based on TODIM and Best Worst Method-Water Filling Theory in Pythagorean Fuzzy Language Environment for Reliability Assessment of Industrial Robot
ASME J. Risk Uncertainty Part B (June,2025)
An Enhanced Failure Mode Effect Analysis-Based Risk Assessment for Subsea Compressor Systems
J. Offshore Mech. Arct. Eng (April,2022)
Design Process Error Proofing: Failure Modes and Effects Analysis of the Design Process
J. Mech. Des (May,2007)
Related Chapters
Introduction
Thermal Management of Microelectronic Equipment
The Latest Hot CD
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment