A failure model has been developed for indium die attach fatigue in extreme cold temperature environment applications, such as distributed control systems for planetary exploration. The model contains both a stress component, which is based on the packaging structure, and a damage component, which is based solely on the material properties. The stress model is developed for a wire bonded, hermetic ceramic module containing a SiGe hetero-junction bipolar transistor intended for use in a lunar base. The model was calibrated using results from −196°C to 125°C thermal shock testing.
- Electronic and Photonic Packaging Division
Reliability of Indium Solder for Cold Temperature Packaging
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Wu, R, & McCluskey, FP. "Reliability of Indium Solder for Cold Temperature Packaging." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 553-556. ASME. https://doi.org/10.1115/IPACK2007-33456
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