Characterization of 1^st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications

We have developed the first MEMS high-strain sensor based on the recently developed fabrication technology, the Direct Polymer Patterning On Substrate Technique (DPPOST). DPPOST allows lithographically defined elastomer structures to be directly patterned on a substrate in a similar fashion like the lift-off process of evaporated metals. Silicone elastomers (RTV-11 or RTV-615) are used as the matrix materials for the sensor element due to its mechanical properties and widespread availability. Carbon black nano-particles are used to provide the sensing element electrical resistivity on the order 10 Ω-cm. This paper will discuss the design, fabrication, and development of the 1^st generation MEMS high strain sensor; for experimental measurements on a highly elastic wing in a low-speed wind-tunnel.