We have developed the first MEMS high-strain sensor based on the recently developed fabrication technology, the Direct Polymer Patterning On Substrate Technique (DPPOST). DPPOST allows lithographically defined elastomer structures to be directly patterned on a substrate in a similar fashion like the lift-off process of evaporated metals. Silicone elastomers (RTV-11 or RTV-615) are used as the matrix materials for the sensor element due to its mechanical properties and widespread availability. Carbon black nano-particles are used to provide the sensing element electrical resistivity on the order 10 Ω-cm. This paper will discuss the design, fabrication, and development of the 1st generation MEMS high strain sensor; for experimental measurements on a highly elastic wing in a low-speed wind-tunnel.
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Characterization of 1st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications
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Madyala, A, & Huang, A. "Characterization of 1st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 509-513. ASME. https://doi.org/10.1115/IPACK2007-33871
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