A unique MEMS encapsulation process on the use of epipolysilicon as a packaging and sealing layer is demonstrated. This process provides a very clean and stable environment for MEMS, is compatible with CMOS integration, and can be carried out in a conventional CMOS facility with standard tools. Silicon resonators fabricated inside the ‘epi-seal’ encapsulation showed quality factors over 10,000 and commercial level long-term stability (ppm level drift for over 1 year of operation). In addition, several modifications and improvements, such as Si-SiO2 composite resonators for reduced temperature coefficient of frequency and thermal isolated anchors for direct temperature control were successfully added to this process for improvements in resonator stability over temperature.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4277-0
PROCEEDINGS PAPER
CMOS Compatible Wafer-Scale Encapsulation MEMS Resonators Available to Purchase
Bongsang Kim,
Bongsang Kim
Stanford University, Stanford, CA
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Matthew A. Hopcroft,
Matthew A. Hopcroft
Stanford University, Stanford, CA
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Renata Melamud,
Renata Melamud
Stanford University, Stanford, CA
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Chandra M. Jha,
Chandra M. Jha
Stanford University, Stanford, CA
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Manu Agarwal,
Manu Agarwal
Stanford University, Stanford, CA
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Saurabh A. Chandorkar,
Saurabh A. Chandorkar
Stanford University, Stanford, CA
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Thomas W. Kenny
Thomas W. Kenny
Stanford University, Stanford, CA
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Bongsang Kim
Stanford University, Stanford, CA
Matthew A. Hopcroft
Stanford University, Stanford, CA
Renata Melamud
Stanford University, Stanford, CA
Chandra M. Jha
Stanford University, Stanford, CA
Manu Agarwal
Stanford University, Stanford, CA
Saurabh A. Chandorkar
Stanford University, Stanford, CA
Thomas W. Kenny
Stanford University, Stanford, CA
Paper No:
IPACK2007-33234, pp. 499-504; 6 pages
Published Online:
January 8, 2010
Citation
Kim, B, Hopcroft, MA, Melamud, R, Jha, CM, Agarwal, M, Chandorkar, SA, & Kenny, TW. "CMOS Compatible Wafer-Scale Encapsulation MEMS Resonators." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 499-504. ASME. https://doi.org/10.1115/IPACK2007-33234
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