This paper presents a fully dry assembly method to obtain densely packed arrays of parts from 400–800μm in size. This approach shows promise for enabling formation of a module of n and p type materials optimized for micro scale thermoelectric cooling performance.
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Template Based Assembly for Solid State Cooling
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Wang, K, Baskaran, R, & Bo¨hringer, KF. "Template Based Assembly for Solid State Cooling." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 435-437. ASME. https://doi.org/10.1115/IPACK2007-33474
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