With the rapid growth of IC industry in China, microelectronic packaging industry is playing more and more important role in this country. And the lack of talents on microelectronic packaging becomes the bottleneck to limit the development of microelectronic packaging industry in China. So with the great support from Intel, an industry-orientated graduate course on microelectronic packaging was developed in Shanghai Jiao Tong University and opened to all graduates or senior undergraduates in this university. This course is designed to serve as an introduction and a review on microelectronic packaging. Some topics about design considerations, materials, process flow and typical techniques of microelectronic packaging including advanced packaging technologies are addressed. Fundamentals and methodologies of reliability and failure analysis are also covered in this course. At last, a brief introduction on PCB assembly is concerns. A laboratory experiment and factory visiting on packaging process are included in this course to improve the students’ practice ability and deepen their comprehension on modern packaging manufacturing. Most of lectures in this course are taught by experienced engineers from industry to increase its characterization on industrialization. This course will be helpful to students intending to specialize in microelectronic packaging. At last further plans on this course and related curriculum about microelectronic packaging are introduced briefly.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4277-0
PROCEEDINGS PAPER
Development of an Industry-Oriented Graduate Course on Microelectronic Packaging in China Available to Purchase
Xiu-Lan Cheng,
Xiu-Lan Cheng
Shanghai Jiao Tong University, Shanghai, China
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Yu-Zhuo Fu,
Yu-Zhuo Fu
Shanghai Jiao Tong University, Shanghai, China
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Cheng Yang,
Cheng Yang
Intel Products (Shanghai) Ltd., Shanghai, China
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Yan Chen
Yan Chen
Intel Products (Shanghai) Ltd., Shanghai, China
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Xiu-Lan Cheng
Shanghai Jiao Tong University, Shanghai, China
Yu-Zhuo Fu
Shanghai Jiao Tong University, Shanghai, China
Cheng Yang
Intel Products (Shanghai) Ltd., Shanghai, China
Yan Chen
Intel Products (Shanghai) Ltd., Shanghai, China
Paper No:
IPACK2007-33334, pp. 429-433; 5 pages
Published Online:
January 8, 2010
Citation
Cheng, X, Fu, Y, Yang, C, & Chen, Y. "Development of an Industry-Oriented Graduate Course on Microelectronic Packaging in China." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 429-433. ASME. https://doi.org/10.1115/IPACK2007-33334
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