Thermal interface materials are used to reduce the interfacial thermal resistance between contacting surfaces inside electronic packages, such as at the die-heat sink or heat spreader-heat sink interfaces. In this study, the change in thermal performance was measured for elastomeric gap pads, gap fillers, and an adhesive throughout reliability tests. Three-layer composite structures were used to simulate loading conditions encountered by thermal interface materials in actual applications. The thermal resistance of the thermal interface material, including contact and bulk resistance, was calculated using the Lee algorithm, an iterative method that uses properties of the single layers and the 3-layer composite structures, measured using the laser flash method. Test samples were subjected to thermal cycling tests, which induced thermomechanical stresses due to the mismatch in the coefficients of thermal expansion of the dissimilar coupon materials. The thermal resistance measurements from the laser flash showed little change or slight improvement in the thermal performance over the course of temperature cycling. Scanning acoustic microscope images revealed delamination in one group of gap pad samples and cracking in the putty samples.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4277-0
PROCEEDINGS PAPER
Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method
Vinh Khuu,
Vinh Khuu
University of Maryland, College Park, MD
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Michael Osterman,
Michael Osterman
University of Maryland, College Park, MD
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Avram Bar-Cohen,
Avram Bar-Cohen
University of Maryland, College Park, MD
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Michael Pecht
Michael Pecht
University of Maryland, College Park, MD
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Vinh Khuu
University of Maryland, College Park, MD
Michael Osterman
University of Maryland, College Park, MD
Avram Bar-Cohen
University of Maryland, College Park, MD
Michael Pecht
University of Maryland, College Park, MD
Paper No:
IPACK2007-33554, pp. 405-414; 10 pages
Published Online:
January 8, 2010
Citation
Khuu, V, Osterman, M, Bar-Cohen, A, & Pecht, M. "Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 405-414. ASME. https://doi.org/10.1115/IPACK2007-33554
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