The use of flexible substrates is growing in many applications such as computer peripherals, hand held devices, telecommunications, automotive, aerospace, etc. The drive to adopt flexible circuits is due to their ability to reduce size, weight, assembly time and cost of the final product. They also accommodate flexibility by allowing relative movement between component parts and provide a route for three dimensional packaging. This paper will describe some of the current research results from the Flex-No-Lead project, a European Commission sponsored research program. The principle aim of this project is to investigate the processing, performance, and reliability of flexible substrates when subjected to new environmentally friendly, lead-free soldering technologies. This paper will discuss the impact of specific design variables on performance and reliability. In particular the paper will focus on copper track designs, substrate material, dielectric material and solder-mask defined joints.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4277-0
PROCEEDINGS PAPER
Modelling the Reliability of Components on Flexible Substrates Available to Purchase
H. Lu
H. Lu
University of Greenwich, London, UK
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J. Rizvi
University of Greenwich, London, UK
C. Yin
University of Greenwich, London, UK
C. Bailey
University of Greenwich, London, UK
H. Lu
University of Greenwich, London, UK
Paper No:
IPACK2007-33820, pp. 375-380; 6 pages
Published Online:
January 8, 2010
Citation
Rizvi, J, Yin, C, Bailey, C, & Lu, H. "Modelling the Reliability of Components on Flexible Substrates." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 375-380. ASME. https://doi.org/10.1115/IPACK2007-33820
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