Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A novel solder bump inspection system has been developed using laser ultrasound and interferometric techniques. In this research, modal analysis is important to correlate the defects with dynamic responses of packaged electronic devices. The effect of solder bump defects on the mode frequencies and mode shapes is investigated in this paper. The objective is to develop a modal analysis approach integrating analytical, numerical and experimental methods. In particular, this paper discusses the analytical modeling, numerical modeling, and out-of-plane vibration experiment for a 6.35mm×6.35mm×0.6mm non-underfilled PB18 flip chip on a FR4 board.
- Electronic and Photonic Packaging Division
Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses
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Yang, J, & Ume, IC. "Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 365-374. ASME. https://doi.org/10.1115/IPACK2007-33542
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