Solder bump inspection of surface mount packages has been a crucial process in the electronics manufacturing industry. A novel solder bump inspection system has been developed using laser ultrasound and interferometric techniques. In this research, modal analysis is important to correlate the defects with dynamic responses of packaged electronic devices. The effect of solder bump defects on the mode frequencies and mode shapes is investigated in this paper. The objective is to develop a modal analysis approach integrating analytical, numerical and experimental methods. In particular, this paper discusses the analytical modeling, numerical modeling, and out-of-plane vibration experiment for a 6.35mm×6.35mm×0.6mm non-underfilled PB18 flip chip on a FR4 board.

Volume Subject Area:
Interconnect Reliability Models
Topics:
Flip-chip, Flip-chip devices, Inspection, Modal analysis, Solders, Computer simulation, Dynamic response, Electronics, Experimental methods, Interferometry, Lasers, Manufacturing industry, Mode shapes, Modeling, Surface mount packaging, Ultrasound, Vibration
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Copyright © 2007
 by ASME
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