In this study, we fabricated bismuth-telluride thin films and their in-plane thermoelectric micro-coolers (4mm×4mm) by using the flash evaporation method. We prepared fine powders of Bi2.0Te2.7Se0.3 (n-type) and Bi0.4Te3.0Sb1.6 (p-type). The thermoelectric properties of as-grown thin films are lower than those of bulk materials. Therefore the as-grown thin films were annealed in hydrogen at atmospheric pressure for 1 hour in a temperature range of 200 to 400°C. By optimizing the annealing temperature, thin films with high thermoelectric power factors of 8.8 μW/(cm·K2) in n-type and 13.8 μW/(cm·K2) in p-type are obtained. To evaluate the figure of merit of the thin film, the thermal conductivity of the n-type thin film is measured by the 3ω method. The thin film annealed at 200 °C exhibited a cross-plane thermal conductivity of 1.2 W/(m·K). Micro-coolers of flash-evaporated bismuth-telluride thin films are fabricated using three shadow masks. The shadow masks are prepared by standard micro-fabrication processes such as nitridation of Si, dry etching, and wet etching. Thermoelectric power of the as-grown thin film devices with 16 pairs of p-n legs are measured by YAG laser heating at the center of the devices. The thermoelectric power of thermoelectric legs is evaluated to be 180μV/K per one p-n leg pair. According to the Kelvin’s law, it corresponds to 54mV Peltier coefficient per p-n pair.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4277-0
PROCEEDINGS PAPER
Thermoelectric Micro-Cooler of Bismuth Telluride Thin Films
Koji Miyazaki,
Koji Miyazaki
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
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Jun-Ichiro Kurosaki,
Jun-Ichiro Kurosaki
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
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Masayuki Takashiri,
Masayuki Takashiri
Komatsu Ltd., Hiratsuka, Kanagawa, Japan
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Bertrand Lenoir,
Bertrand Lenoir
Ecole des Mines de Nancy, Nancy, France
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Hiroshi Tsukamoto
Hiroshi Tsukamoto
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
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Koji Miyazaki
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
Jun-Ichiro Kurosaki
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
Masayuki Takashiri
Komatsu Ltd., Hiratsuka, Kanagawa, Japan
Bertrand Lenoir
Ecole des Mines de Nancy, Nancy, France
Hiroshi Tsukamoto
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
Paper No:
IPACK2007-33756, pp. 335-342; 8 pages
Published Online:
January 8, 2010
Citation
Miyazaki, K, Kurosaki, J, Takashiri, M, Lenoir, B, & Tsukamoto, H. "Thermoelectric Micro-Cooler of Bismuth Telluride Thin Films." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 335-342. ASME. https://doi.org/10.1115/IPACK2007-33756
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