We have evaluated a new Ag-filled silicone thermal interface material (TIM) for its sensitivity to lid finish and impact on imaging discontinuities in the die/lid (TIM1) layer, in conjunction with two high performance lid materials, as a part of our advanced packaging technology development effort. Thermal and mechanical (shear stress and lid pull) measurements have been carried out on a number of different lid finishes to optimize thermal performance and adhesion at the TIM1/lid interface. This silicone TIM1 is found to be sensitive to the type of Ni-plating and plating bath chemistry. Nondestructive and destructive metrology has been carried out on flip chip (FC) packages using Ag-filled silicone TIM1 and either Cu or AlSiC lids. A number of silicone formulations have been investigated to assess their impact on surface acoustic microscopy (SAM) and X-ray imaging. Nondestructive evaluation (NDE) by real time X-ray and SAM has identified artifacts that make it difficult to unambiguously detect voids and delamination in the TIM1 layer. A “dark ring” or “picture frame” artifact is observed at the die perimeter in acoustic microscope images of packages with the Ag-filled TIM1. Detailed SEM cross-section and thermal mapping analyses on a number of specially constructed FC packages have been correlated with TIM1/lid delamination and voiding observed in SAM and X-ray images. Results of these studies point to changes in the TIM1 modulus during cure and post cure thermal excursions as the cause of the “dark ring” observed in the transmission SAM images rather than delamination at the TIM1/lid or TIM1/die interfaces. However, in the event that delamination is present at the edges it cannot be unambiguously deconvoluted from the “dark ring” artifact in the SAM images.
Skip Nav Destination
ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4277-0
PROCEEDINGS PAPER
Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials Available to Purchase
Margaret Stern,
Margaret Stern
Sun Microsystems, Inc., Santa Clara, CA
Search for other works by this author on:
Bob Melanson,
Bob Melanson
Sun Microsystems, Inc., Santa Clara, CA
Search for other works by this author on:
Vadim Gektin,
Vadim Gektin
Sun Microsystems, Inc., Santa Clara, CA
Search for other works by this author on:
Paul Hundt,
Paul Hundt
Texas Instruments, Inc., Dallas, TX
Search for other works by this author on:
Carlos Arroyo,
Carlos Arroyo
Texas Instruments, Inc., Dallas, TX
Search for other works by this author on:
Vikas Gupta,
Vikas Gupta
Texas Instruments, Inc., Dallas, TX
Search for other works by this author on:
Kazumi Nakayoshi,
Kazumi Nakayoshi
Dow Corning, Toray Company, Inc., Midland, MI
Search for other works by this author on:
Lyndon Larson,
Lyndon Larson
Dow Corning Corporation, Midland, MI
Search for other works by this author on:
Jesus Marin,
Jesus Marin
Dow Corning Corporation, Midland, MI
Search for other works by this author on:
David McDougall,
David McDougall
Dow Corning Corporation, Midland, MI
Search for other works by this author on:
Dorab Bhagwagar
Dorab Bhagwagar
Dow Corning Corporation, Midland, MI
Search for other works by this author on:
Margaret Stern
Sun Microsystems, Inc., Santa Clara, CA
Bob Melanson
Sun Microsystems, Inc., Santa Clara, CA
Vadim Gektin
Sun Microsystems, Inc., Santa Clara, CA
Paul Hundt
Texas Instruments, Inc., Dallas, TX
Carlos Arroyo
Texas Instruments, Inc., Dallas, TX
Vikas Gupta
Texas Instruments, Inc., Dallas, TX
Kazumi Nakayoshi
Dow Corning, Toray Company, Inc., Midland, MI
Lyndon Larson
Dow Corning Corporation, Midland, MI
Jesus Marin
Dow Corning Corporation, Midland, MI
David McDougall
Dow Corning Corporation, Midland, MI
Dorab Bhagwagar
Dow Corning Corporation, Midland, MI
Paper No:
IPACK2007-33629, pp. 309-317; 9 pages
Published Online:
January 8, 2010
Citation
Stern, M, Melanson, B, Gektin, V, Hundt, P, Arroyo, C, Gupta, V, Nakayoshi, K, Larson, L, Marin, J, McDougall, D, & Bhagwagar, D. "Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 309-317. ASME. https://doi.org/10.1115/IPACK2007-33629
Download citation file:
24
Views
Related Proceedings Papers
Related Articles
Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
J. Electron. Packag (June,2005)
Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
J. Electron. Packag (June,2011)
Research of Underfill Delamination in Flip Chip by the J -Integral Method
J. Electron. Packag (March,2004)
Related Chapters
Development of New Process and Product Monitoring Technologies for the Manufacturing of High Value Alloy Steels for Use in Critical Applications
Bearing and Transmission Steels Technology
A Novel Weapon Detection Framework in High-Energy X-Ray Dual-Energy Images Based on Shape and Edge Features
International Conference on Software Technology and Engineering, 3rd (ICSTE 2011)
Genetic Approach for Predicting the Missing Value of the Pixel
International Conference on Mechanical and Electrical Technology, 3rd, (ICMET-China 2011), Volumes 1–3