The shift of the DC characteristics of nMOSFETs during a resin-molding process was investigated experimentally. A silicon chip including the nMOSFETs was encapsulated in a quad flat package, and the drain current and transconductance shifts were measured. The drain current decreased during the resin-molding process, while no significant shift in threshold voltage was observed. The experimental results were estimated adequately from the residual stress predicted by numerical and experimental analysis, and from the stress sensitivity of the nMOSFETs measured by the four-point bending method. Also, we verified the validity of an electron mobility model that includes the effect of stress, used for drift-diffusion device simulation, by comparison with experimental results, and several improvements to the electron mobility model were found out.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4277-0
PROCEEDINGS PAPER
Stress-Induced Effects in Electronic Characteristics of n-Type MOSFETs in Resin-Molded Packages
Masaaki Koganemaru,
Masaaki Koganemaru
Mechanics & Electronics Research Institute, Kitakyushu, Fukuoka, Japan
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Toru Ikeda,
Toru Ikeda
Kyoto University, Kyoto, Kyoto, Japan
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Noriyuki Miyazaki,
Noriyuki Miyazaki
Kyoto University, Kyoto, Kyoto, Japan
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Hajime Tomokage
Hajime Tomokage
Fukuoka University, Fukuoka, Fukuoka, Japan
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Masaaki Koganemaru
Mechanics & Electronics Research Institute, Kitakyushu, Fukuoka, Japan
Toru Ikeda
Kyoto University, Kyoto, Kyoto, Japan
Noriyuki Miyazaki
Kyoto University, Kyoto, Kyoto, Japan
Hajime Tomokage
Fukuoka University, Fukuoka, Fukuoka, Japan
Paper No:
IPACK2007-33533, pp. 277-284; 8 pages
Published Online:
January 8, 2010
Citation
Koganemaru, M, Ikeda, T, Miyazaki, N, & Tomokage, H. "Stress-Induced Effects in Electronic Characteristics of n-Type MOSFETs in Resin-Molded Packages." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 277-284. ASME. https://doi.org/10.1115/IPACK2007-33533
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