In this paper, a thermal enhanced design for a high power density system in package (SiP) is proposed to resolve the challenge faced by the packaging research community in eliminating the hot spot and reducing the junction temperature in a high operation temperature. The SiP structure includes seven sub-chips which are attached to the chip carrier. The dissipated heat is conducted to the metal slug by thermal vias, while some heat is conducted to the pads by metal traces. Finally, the whole module is connected to the test board by solder paste material. In the thermal enhanced design, a highly conductive material such as solder paste is applied to make an attachment between the chip carrier and the highest power density chip (the power amplifier chip). Besides, some thermal vias are constructed to conduct the dissipated heat from the chip carrier to the metal slug. The new structure greatly improves the thermal performance of the SiP structure. Moreover, the hot spot on the chip carrier is also eliminated in this thermal enhanced SiP structure.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4277-0
PROCEEDINGS PAPER
Thermal Management on Hot Spot Elimination / Junction Temperature Reduction for High Power Density System in Package Structure
Chan-Yen Chou,
Chan-Yen Chou
National Tsing Hua University, Hsinchu, Taiwan
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Chung-Jung Wu,
Chung-Jung Wu
National Tsing Hua University, Hsinchu, Taiwan
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Hsiu-Ping Wei,
Hsiu-Ping Wei
National Tsing Hua University, Hsinchu, Taiwan
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Ming-Chih Yew,
Ming-Chih Yew
National Tsing Hua University, Hsinchu, Taiwan
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Chien-Chia Chiu,
Chien-Chia Chiu
National Tsing Hua University, Hsinchu, Taiwan
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Kuo-Ning Chiang
Kuo-Ning Chiang
National Tsing Hua University, Hsinchu, Taiwan
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Chan-Yen Chou
National Tsing Hua University, Hsinchu, Taiwan
Chung-Jung Wu
National Tsing Hua University, Hsinchu, Taiwan
Hsiu-Ping Wei
National Tsing Hua University, Hsinchu, Taiwan
Ming-Chih Yew
National Tsing Hua University, Hsinchu, Taiwan
Chien-Chia Chiu
National Tsing Hua University, Hsinchu, Taiwan
Kuo-Ning Chiang
National Tsing Hua University, Hsinchu, Taiwan
Paper No:
IPACK2007-33534, pp. 227-232; 6 pages
Published Online:
January 8, 2010
Citation
Chou, C, Wu, C, Wei, H, Yew, M, Chiu, C, & Chiang, K. "Thermal Management on Hot Spot Elimination / Junction Temperature Reduction for High Power Density System in Package Structure." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 227-232. ASME. https://doi.org/10.1115/IPACK2007-33534
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