Laminar forced convection in two-dimensional rectangular micro and nano-channels under hydrodynamically and thermally fully developed conditions is investigated analytically in the slip flow regime (0.001 < Kn < 0.1). Closed form solutions for fluid friction and Nusselt numbers are obtained by solving the continuum momentum and energy equations with the first-order velocity slip and temperature jump boundary conditions at the channel walls. Isoflux thermal boundary condition is applied on the heat sink base. Results of the present analysis are presented in terms of channel aspect ratio, hydraulic diameter, momentum and thermal accommodation coefficients, Knudsen number, slip velocity, Reynolds number and Prandtl number. It is found that fluid friction decreases and heat transfer increases, compared to no-slip flow conditions, depending on aspect ratios and Knudsen numbers that include effects of the channel size or rarefaction and the fluid/wall interaction.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4277-0
PROCEEDINGS PAPER
Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks Available to Purchase
Waqar A. Khan,
Waqar A. Khan
CIIT - Abbottabad, Abbottabad, NWFP, Pakistan
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Michael M. Yovanovich
Michael M. Yovanovich
University of Waterloo, Waterloo, ON, Canada
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Waqar A. Khan
CIIT - Abbottabad, Abbottabad, NWFP, Pakistan
Michael M. Yovanovich
University of Waterloo, Waterloo, ON, Canada
Paper No:
IPACK2007-33636, pp. 199-209; 11 pages
Published Online:
January 8, 2010
Citation
Khan, WA, & Yovanovich, MM. "Analytical Modeling of Fluid Flow and Heat Transfer in Micro/Nano-Channel Heat Sinks." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 199-209. ASME. https://doi.org/10.1115/IPACK2007-33636
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