Progress in micromachining technology enabled fabrication of micron-sized mechanical devices, which have had a major impact on many disciplines. These devices have not only led to development of miniature transducers for sensing and actuation, but also a chip-based chemical laboratory (μChemLab) and other microelectromechanical systems (MEMS). Applications of these microscale systems frequently demand heat removal and temperature control. This paper presents preliminary results of a study of heat transfer in microscale systems. Computational modeling is based on Thermal Analysis System (TAS), which facilitates multiscale modeling/simulation, and measurements are made using infrared (IR) microscopy. Representative applications describe multiscale modeling and measurement results obtained for a microhotplate of a μChemLab and a high-power GaAs FET amplifier. Comparison of the preliminary experimental/measurement and computational/modeling results shows good correlation.
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Study of Heat Transfer in Microscale Systems
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Pryputniewicz, RJ, & Pryputniewicz, DR. "Study of Heat Transfer in Microscale Systems." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 155-162. ASME. https://doi.org/10.1115/IPACK2007-33269
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