This paper describes microscale fluidic chip I/O interconnects to enable the delivery of a coolant from substrate-level fluidic channels to a CMOS chip with an integrated silicon microchannel heat sink. It is shown that the fluidic I/Os are flip-chip compatible and can be assembled simultaneously with C4 bumps. The cooling of >300 W/cm2 is demonstrated using the microfluidic chip I/Os. Their compatibility with optical I/Os and the mechanical compliance characterization of the optical I/Os are also described. Experimental research is reported in the fabrication, assembly, and testing of a chip with electrical and fluidic I/O interconnects.
- Electronic and Photonic Packaging Division
Electrical, Optical and Thermofluidic Chip I/O Interconnections
Bakir, MS, Dang, B, & Meindl, JD. "Electrical, Optical and Thermofluidic Chip I/O Interconnections." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 1. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 11-17. ASME. https://doi.org/10.1115/IPACK2007-33464
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