Electrical, Optical and Thermofluidic Chip I/O Interconnections

This paper describes microscale fluidic chip I/O interconnects to enable the delivery of a coolant from substrate-level fluidic channels to a CMOS chip with an integrated silicon microchannel heat sink. It is shown that the fluidic I/Os are flip-chip compatible and can be assembled simultaneously with C4 bumps. The cooling of >300 W/cm² is demonstrated using the microfluidic chip I/Os. Their compatibility with optical I/Os and the mechanical compliance characterization of the optical I/Os are also described. Experimental research is reported in the fabrication, assembly, and testing of a chip with electrical and fluidic I/O interconnects.