This paper addresses cracking in solder thermal interface materials (STIMs) used in electronic packages under accelerated testing or service conditions. Finite-element models of various packages have been built to study the deformation in the STIM through a few cycles of accelerated testing. Two commonly observed failure modes — center/off-center brittle interfacial cracking, and cohesive corner cracking — were looked at. The success of the modeling approach was evaluated by comparison with thermal impedance data, as well as with CSAM images showing the extent of cracking in the STIM. It is shown that the models agree qualitatively with experimental data, both in terms of failure locations, as well as in terms of rank ordering different packages in terms of STIM degradation.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Mechanical Modeling of a Solder Thermal Interface Material: Implications for Thermo-Mechanical Reliability Available to Purchase
Sankara J. Subramanian
Sankara J. Subramanian
Intel Corporation, Chandler, AZ
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Sankara J. Subramanian
Intel Corporation, Chandler, AZ
Paper No:
IPACK2005-73304, pp. 959-963; 5 pages
Published Online:
March 4, 2009
Citation
Subramanian, SJ. "Mechanical Modeling of a Solder Thermal Interface Material: Implications for Thermo-Mechanical Reliability." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 959-963. ASME. https://doi.org/10.1115/IPACK2005-73304
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