We show system modeling and measurement results of a platform with array capacitor solution (ACS) within the frequency domain. A Pentium® 4 microprocessor package was redesigned for a single array capacitor, in place of all multiterminal capacitors. Its system power delivery impedance profile was found to have a more desirable high frequency response than the earlier system designed with discrete multiterminal capacitors. These measured results were also found to agree well with the behavior predicted by simulation models. Additionally we explore the impact and optimization of array capacitor parameters on the overall system frequency response.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Use of Array Capacitors to Improve the Power Delivery Performance of a Microprocessor System
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Eilert, KD, Radhakrishnan, K, Hill, MJ, & Aygu¨n, K. "Use of Array Capacitors to Improve the Power Delivery Performance of a Microprocessor System." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 955-958. ASME. https://doi.org/10.1115/IPACK2005-73301
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