We present a technique for the characterization and analysis of the thermal stress in the optical substrate of packaged photonic devices. This method allows optimization of the package geometry in order to improve the passive compensation of the thermal sensitivity of photonic devices. To the best of our knowledge, we report for the first time the use of strongly chirped, weakly apodized fiber Bragg grating (FBG) sensors to evaluate the stress distribution induced by the package in the planar lightwave circuit (PLC) substrate. We also evaluated the substrate thermal stress using finite element analysis (FEA). We investigated some of the package design parameters that can be used to control and tune the amount of stress that can be applied to the photonic device optical substrate. Our goal is to optimize the design of a package that applies tensile stress to the optical device to compensate unwanted effects due to ambient temperature variation.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Characterization of Thermal Stress Phenomena Induced Into a Packaged Planar Lightwave Circuit Using Fiber Bragg Grating Sensors
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Grobnic, AG, James, R, Lu, P, & Mihailov, SJ. "Characterization of Thermal Stress Phenomena Induced Into a Packaged Planar Lightwave Circuit Using Fiber Bragg Grating Sensors." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 899-906. ASME. https://doi.org/10.1115/IPACK2005-73209
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