In the present research a BGA (Ball Grid Array) type Sn-3Ag-0.5Cu solder ball was reflowed on Cu/Ni/Au pad using a Sn-3.5Ag-0.5Bi-8In solder or a Sn-8Zn-3Bi solder with varying reflow peak temperature and the interfacial microstructure and joint strength were evaluated. The strength of the Sn-3.5Ag-0.5Bi-8In solder joints reached the maximum value at reflow peak temperature of 483K to 493K and then decreased with increasing reflow temperature, whereas the Sn-8Zn-3Bi solder joints had high strength at the higher reflow peak temperature of 503K. In the Sn-3.5Ag-0.5Bi-8In solder joints, at a reflow peak temperature of 493K or less, a thin Ni-Sn type intermetallic layer formed at the interface between the solder and the pad. However at the higher reflow peak temperatures a clumpy (Cu, Ni)6Sn5 phase locally formed on the Ni-Sn interfacial reaction layer. This is caused by Cu from melted Sn-Ag-Cu ball reacting to Ni and Sn in the interfacial region. The (Cu, Ni)6Sn5 clumps increased with reflow peak temperature. Some void-like defects existed at the interface between the Ni-Sn layer and (Cu, Ni)6Sn5 clumps. These defects can act as crack initiation sites and thereby cause the degradation of the joint strength. It is concluded from the results that when the Sn-3.5Ag-0.5Bi-8In solder is applied to reflow soldering of the packages having Sn-Ag-Cu solder bump on the Cu/Ni/Au pad, the reflow peak temperature should be controlled ranging from 483K to 493K. When the reflow peak temperature was over 493K, a holding of 20s at the peak temperature, which resulted in diminish the void-like defects at the interface between the Ni-Sn layer and the (Cu, Ni)6Sn5 clumps, improved the joint strength.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Effects of Interfacial Microstructure on Strength of Solder Joint Using Sn-Ag-Bi-In Solder Available to Purchase
Akio Hirose,
Akio Hirose
Osaka University, Suita, Osaka, Japan
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Takashi Hojo,
Takashi Hojo
Osaka University, Suita, Osaka, Japan
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Yosuke Sogo,
Yosuke Sogo
Osaka University, Suita, Osaka, Japan
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Ryoko Miwa,
Ryoko Miwa
Osaka University, Suita, Osaka, Japan
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Kojiro F. Kobayashi,
Kojiro F. Kobayashi
Osaka University, Suita, Osaka, Japan
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Atsushi Yamaguchi,
Atsushi Yamaguchi
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
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Akio Furusawa,
Akio Furusawa
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
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Kazuto Nishida
Kazuto Nishida
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
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Akio Hirose
Osaka University, Suita, Osaka, Japan
Takashi Hojo
Osaka University, Suita, Osaka, Japan
Yosuke Sogo
Osaka University, Suita, Osaka, Japan
Ryoko Miwa
Osaka University, Suita, Osaka, Japan
Kojiro F. Kobayashi
Osaka University, Suita, Osaka, Japan
Atsushi Yamaguchi
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
Akio Furusawa
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
Kazuto Nishida
Matsushita Electric Industrial Company, Ltd., Kadoma, Osaka, Japan
Paper No:
IPACK2005-73167, pp. 893-898; 6 pages
Published Online:
March 4, 2009
Citation
Hirose, A, Hojo, T, Sogo, Y, Miwa, R, Kobayashi, KF, Yamaguchi, A, Furusawa, A, & Nishida, K. "Effects of Interfacial Microstructure on Strength of Solder Joint Using Sn-Ag-Bi-In Solder." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 893-898. ASME. https://doi.org/10.1115/IPACK2005-73167
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