We describe technology in which multiple components inside a circuit pack shielded from electromagnetic interference (EMI) are efficiently cooled by individual heat sinks that protrude into an external airflow through openings in the lid of the shield. Compliant, electrically conductive gaskets are used to form a perimeter seal between the bases of the heat sinks and the lid of the enclosure. The gaskets accommodate variations in the heights of the components and allow solid-to-solid contact in the thermal-grease-filled interface between the components and their heat sinks without compromising EMI shielding. This technology provides efficient cooling because the heat sinks can be tailored to the thermal loads of the individual components. Moreover, a set of small heat sinks presents a lower impedance to the cooling airflow than the conventional configuration of fins covering the entire lid of an EMI shield. We have examined the implementation of this solution using ICEPAK® thermal modeling software and by experiment. It leads to acceptable thermal performance and lower impedance to air flow relative to the conventional approach. It also has important potential advantages in cost, weight, and ease of rework.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Efficient Cooling of Multiple Components in a Shielded Circuit Pack
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Kolodner, P, Bolle, C, & Hodes, M. "Efficient Cooling of Multiple Components in a Shielded Circuit Pack." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 71-78. ASME. https://doi.org/10.1115/IPACK2005-73071
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