Passive cooling enhancement with least additional mass of the material on the external wall can be a method for least energy thermal management for the consumer electronics. Previously, the channeled wall enhancement was found to have potentially four fold performance compare to the single wall in the analysis work, in which the enhancement factor with optimum shape with appropriate thermal conductivity of the material was presented. This method is assumed promising to help the energy efficient and quieter thermal design without sacrificing the valuable flat cosmetic surface of equipment. In this paper, flow regime in a channel composite wall is observed experimentally with PIV method as well as thermal resistance of the wall is observed in the same apparatus. These observation results are discussed with numerical analysis. The discussion is summarized with cooling enhancement factor based on the allowable temperature with comparing to the single wall. The result provides the strong evidence for the optimization on proposed analytic models.
Skip Nav Destination
ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Experimental Validation of Channeled Wall Passive Cooling Enhancement
Kazuaki Yazawa,
Kazuaki Yazawa
Sony Corporation, Tokyo, Japan
Search for other works by this author on:
Yasushi Nishino,
Yasushi Nishino
Toyama Prefectural University, Kosugi, Toyama, Japan
Search for other works by this author on:
Shinji Nakagawa,
Shinji Nakagawa
Toyama Prefectural University, Kosugi, Toyama, Japan
Search for other works by this author on:
Masaru Ishizuka
Masaru Ishizuka
Toyama Prefectural University, Kosugi, Toyama, Japan
Search for other works by this author on:
Kazuaki Yazawa
Sony Corporation, Tokyo, Japan
Yasushi Nishino
Toyama Prefectural University, Kosugi, Toyama, Japan
Shinji Nakagawa
Toyama Prefectural University, Kosugi, Toyama, Japan
Masaru Ishizuka
Toyama Prefectural University, Kosugi, Toyama, Japan
Paper No:
IPACK2005-73078, pp. 709-716; 8 pages
Published Online:
March 4, 2009
Citation
Yazawa, K, Nishino, Y, Nakagawa, S, & Ishizuka, M. "Experimental Validation of Channeled Wall Passive Cooling Enhancement." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 709-716. ASME. https://doi.org/10.1115/IPACK2005-73078
Download citation file:
10
Views
Related Proceedings Papers
Related Articles
Two Constructal Routes to Minimal Heat Flow Resistance via Greater Internal Complexity
J. Heat Transfer (February,1999)
A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages
J. Heat Transfer (November,1998)
Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication
J. Electron. Packag (December,2004)
Related Chapters
Tales of the JEDEC Knight
More Hot Air
Optimization of Performance Specifications Based on Environmental Parameters
Inaugural US-EU-China Thermophysics Conference-Renewable Energy 2009 (UECTC 2009 Proceedings)
Telecom: A Field with Myths and Mistakes All Its Own
More Hot Air