High operating heat fluxes and small boiling space are the two major challenges to apply boiling heat transfer in electronics cooling. This experimental study seeks to find a good boiling performance surface that is suitable for cooling a CPU dissipating up to 88 W through a 14 mm × 14 mm surface area in a 15 mm × 54mm × 54mm vessel. Three structured boiling surfaces and three porous surfaces were tested in water at 60°C pool temperature. The experimental data showed that the best cross-grooved surface and the best porous surface have similar boiling performance curves. The evaporation resistances of these two surfaces vary from 0.12 to 0.26 K/W. The minimum evaporation resistance of the best cross-grooved surface was 0.125 K/W at 86.5 W. Because the evaporator area is much smaller than the condenser or the heat sink area, the thermal resistance is dominated by the evaporator. The condensation resistance of the 54mm × 54mm condensing area varies from 0.01 to 0.022 K/W, which is much smaller than the evaporation resistance of every boiling surface in the present test. This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Boiling of Enhanced Surfaces at High Heat Fluxes in a Small Boiler
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Chien, L, & Chen, C. "Boiling of Enhanced Surfaces at High Heat Fluxes in a Small Boiler." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 655-662. ASME. https://doi.org/10.1115/IPACK2005-73457
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