The paper parametrically assesses the impact of the voids/delamination on the system thermal performance. Analysis are carried out numerically and validated against experimental data (thermal measurements and C-SAM images). Topics covered include the relationship between voids/delamination and TIMs’ and heat spreader’s effective thermal conductivity; sensitivity of the system thermal performance to void/delamination size and location; voids/delamination impact vs. on the chip power dissipation (uniform vs. non-uniform); comparison of TIM1 vs. TIM2 voids impact; and, finally, comparison of voids vs. delamination.

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