We demonstrate a prototype chip-scale microfluidic cooling scheme. CMOS compatible processes allow the monolithic integration of the microchannel heat sink into the backside of a Si chip at low temperature (≤260°C). At the front side of a chip, fine pitch area-array solder bumps are fabricated by electroplating for high-density electrical I/O interconnection, while a peripheral array of micro polymer pipes are fabricated as thermal-fluidic I/O interconnects. The resulting “microfluidic flip chip” can be bonded onto a liquid-cooled board substrate using conventional flip-chip assembly processes. The cooling liquid can, therefore, be transferred into a Si chip directly from the board-level manifolds to alleviate the thermal interface issues. This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.
- Heat Transfer Division and Electronic and Photonic Packaging Division
A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects
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Dang, B, Joseph, PJ, Wei, X, Bakir, MS, Kohl, PA, Joshi, YK, & Meindl, JD. "A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 605-610. ASME. https://doi.org/10.1115/IPACK2005-73416
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