This paper discusses the concept of synthetic jet ejectors for forced air cooling and some practical implementations of the same. Synthetic or “zero-mass-flux” jets, unlike conventional jets, require no mass addition to the system, and thus provide means of efficiently directing airflow across a heated surface. Because these jets are zero net mass flux in nature and are comprised entirely of the ambient fluid, they can be conveniently integrated with the surfaces that require cooling without the need for complex plumbing. A synthetic jet ejector mechanism for obtaining high heat transfer rates at low flow rates is discussed. Synthetic jet ejectors consist of a primary “zero-mass-flux” unsteady jet driving a secondary airflow through a channel. Several practical implementations of synthetic jets are introduced from low form factor, low power spot cooling applications to high heat dissipation applications and flow bypass control where synthetic jets are used to enhance fan performance.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Forced Air Cooling With Synthetic Jet Ejectors
Raghav Mahalingam,
Raghav Mahalingam
Georgia Institute of Technology, Atlanta, GA
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Ari Glezer
Ari Glezer
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Raghav Mahalingam
Georgia Institute of Technology, Atlanta, GA
Ari Glezer
Georgia Institute of Technology, Atlanta, GA
Paper No:
IPACK2005-73052, pp. 59-64; 6 pages
Published Online:
March 4, 2009
Citation
Mahalingam, R, & Glezer, A. "Forced Air Cooling With Synthetic Jet Ejectors." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 59-64. ASME. https://doi.org/10.1115/IPACK2005-73052
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