A simplified theoretical model predicting the heat transfer performance of a heat sink base embedded with a flat heat pipe is developed. Numerical analysis was performed using the commercial software FLUENT. The investigation indicates that for heat sink bases embedded with a typical heat pipe, the entire heat sink can be modeled as a flat plate with a uniform temperature and an effective convection heat transfer coefficient. The prediction is compared with the experimental data obtained previously.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Heat Spreading Analysis of a Heat Sink Base Embedded With a Heat Pipe
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Borgmeyer, BV, & Ma, HB. "Heat Spreading Analysis of a Heat Sink Base Embedded With a Heat Pipe." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 553-556. ASME. https://doi.org/10.1115/IPACK2005-73393
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