Data center equipment almost always represents a high expenditure capital investment to the customer, and is often operated without any down time. Data com equipment is typically designed to operate at a rack air inlet temperature of between 10 and 35°C, and a violation of this specification can diminish electronic device reliability and even lead to failure in the field. Thus, it is of paramount importance, from a reliability perspective, to sufficiently understand these systems. A representative non-raised floor data center system was numerically modeled and the data generated from a parametric study was analyzed. The model constitutes a half symmetry section of a 40 rack data center that is arranged in a cold aisle-hot aisle fashion. The effect of several input variables, namely, rack heat load, rack flow rate, rack temperature rise, diffuser flow rate, diffuser location, diffuser height, diffuser pitch, ceiling height, hot exhaust air return vent location, and non-uniformity in rack heat load, was studied. Temperature data was collected at several locations at the inlet to the racks. Statistical analysis was carried out to describe trends in the data.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Thermal Characterization of Non-Raised Floor Air Cooled Data Centers Using Numerical Modeling
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Iyengar, M, Schmidt, R, Sharma, A, McVicker, G, Shrivastava, S, Sri-Jayantha, S, Amemiya, Y, Dang, H, Chainer, T, & Sammakia, B. "Thermal Characterization of Non-Raised Floor Air Cooled Data Centers Using Numerical Modeling." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 535-543. ASME. https://doi.org/10.1115/IPACK2005-73387
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