Measurements and modeling of the thermal resistance of thin (< 100 microns) bond-lines are reported for composite thermal interface materials (TIMs). The composite TIMs consist of alumina particles dispersed in a polymer matrix to form six different adhesive materials. These model TIMs have a common matrix material and are distinguished by their particle size distributions. Bond-lines are formed in a three-layer assembly consisting of a substrate-TIM-substrate structure. The thermal resistance of the bond-line is measured, as a function of bond-line thickness, using the laser flash-technique. A linear variation of resistance with bond-line thickness is observed; Rbl = β · Lbl + Ro. A model is presented that predicts the effective thermal conductivity of the composite as a function of the particle and matrix conductivity, the particle-matrix surface conductance, the particle volume fraction and the particle size distribution. Specifically a method is introduced to account for a broad, continuous size distribution. A particle-matrix surface conductance value of ∼10W/mm2K is found to give good agreement between the measured and predicted effective thermal conductivity values of the composite TIMs.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials
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Lehmann, G, Zhang, H, Gowda, A, & Esler, D. "Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 503-509. ASME. https://doi.org/10.1115/IPACK2005-73380
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