Measurements and modeling of the thermal resistance of thin (< 100 microns) bond-lines are reported for composite thermal interface materials (TIMs). The composite TIMs consist of alumina particles dispersed in a polymer matrix to form six different adhesive materials. These model TIMs have a common matrix material and are distinguished by their particle size distributions. Bond-lines are formed in a three-layer assembly consisting of a substrate-TIM-substrate structure. The thermal resistance of the bond-line is measured, as a function of bond-line thickness, using the laser flash-technique. A linear variation of resistance with bond-line thickness is observed; Rbl = β · Lbl + Ro. A model is presented that predicts the effective thermal conductivity of the composite as a function of the particle and matrix conductivity, the particle-matrix surface conductance, the particle volume fraction and the particle size distribution. Specifically a method is introduced to account for a broad, continuous size distribution. A particle-matrix surface conductance value of ∼10W/mm2K is found to give good agreement between the measured and predicted effective thermal conductivity values of the composite TIMs.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials
Gary Lehmann
,
Gary Lehmann
State University of New York at Binghamton, Binghamton, NY
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Hao Zhang
,
Hao Zhang
State University of New York at Binghamton, Binghamton, NY
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David Esler
David Esler
GE Global Research, Niskayuna, NY
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Gary Lehmann
State University of New York at Binghamton, Binghamton, NY
Hao Zhang
State University of New York at Binghamton, Binghamton, NY
Arun Gowda
GE Global Research, Niskayuna, NY
David Esler
GE Global Research, Niskayuna, NY
Paper No:
IPACK2005-73380, pp. 503-509; 7 pages
Published Online:
March 4, 2009
Citation
Lehmann, G, Zhang, H, Gowda, A, & Esler, D. "Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 503-509. ASME. https://doi.org/10.1115/IPACK2005-73380
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