In this paper, quantitative assessments of single-phase liquid cooled heat sinks based on three types of enhancement microstructures are presented for microelectronics applications. The first type is a metallic microchannel heat sink (MMCHS) made of aluminum with the channel dimensions of 15 mm (L) × 0.2 mm (W) × 2 mm (H). The second type are two silicon microchannel heat sinks (SMCHS) made through the deep reactive ion etching (DRIE) technique, with identical channel height of 0.45mm and average channel widths of 66.6 μm and 46.6μm, respectively. Metallic foam heat sinks (MFHSs) are the third type, which were formed by brazing porous foam materials of high pore density and enlarged surface area onto a copper base plate. All the three types of heat sinks were fabricated and experimentally characterized incorporating electronic packages. Characterization results indicate that the MMCHS and MFHSs can achieve equivalent thermal performance above 100 W/cm2 and the silicon MCHS above 200 W/cm2 at the expense of larger pressure drop. A comparison of the pressure drops, thermal enhancement and manufacturability of the three types of heat sinks is also presented.

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