A new method for power generation based on nano-engineered interface design with partially filled gap is proposed. The device combines electron thermionic emission and tunneling to enhance electron transport. Thermal radiation and tunneling contribute to heat transfer in the device, which can be minimized using selected materials. The largely reduced heat transfer coupled with use of multi-layer structures enable a substantial temperature difference between heat source and heat sink or two electrodes, thereby maximizing heat source utilization. Detailed analyses are provided for the solid device operating either as a power generator or as a cooler.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Multi-Layer Thermionic-Tunneling Structures for Power Generation
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Zeng, T. "Multi-Layer Thermionic-Tunneling Structures for Power Generation." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 2185-2187. ASME. https://doi.org/10.1115/IPACK2005-73448
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