We proposed a methodology for simulation and design of thermoelectric coolers based on the energy balance among the Peltier heat, Joule heat, conduction heat, radiation heat and convection heat and by using the Computational Fluid Dynamics software. Thermal index was proposed for easy prediction of a TEC module efficiency. The prototype of the TEC module was fabricated after the design optimization. Experimental validation was performed by using a thermal characterization system including a chiller and a thermal analyzer. It was found that the simulation and experimental results agreed well.
- Heat Transfer Division and Electronic and Photonic Packaging Division
Thermal Simulation and Experimental Validation for TEC Design
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Shi, P, Wong, S, Tan, YM, Sunappan, V, Fan, W, Chua, KM, Freeman, B, & Jiang, H. "Thermal Simulation and Experimental Validation for TEC Design." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 2173-2178. ASME. https://doi.org/10.1115/IPACK2005-73309
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