Driven by shrinking feature sizes, microprocessor “hot-spots” — with their associated high heat flux and sharp temperature gradients — have emerged as the primary “driver” for on-chip thermal management of today’s IC technology. Solid state thermoelectric micro-coolers offer great promise for reducing the severity of on-chip “hot-spots”, but the theoretical cooling potential of these devices, fabricated on the back of the silicon die in an IC package, has yet to be determined. The results of a three-dimensional electro-thermal finite-element modeling study of such a micro-cooler are presented. Attention is focused on the hot-spot temperature reductions associated with variations in micro-cooler geometry, chip thickness, and chip doping concentration, along with the parasitic Joule heating effects from the electrical contact resistance and current flow through the silicon. The modeling results help to define the optimum solid-state cooling configuration and reveal that, for the conditions examined, nearly 80% of the hot-spot temperature rise of 2.5°C can be removed from a 70μm × 70μm, 680W/cm2 hot-spot on a 50μm thick silicon die with a single micro-cooler.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Thermoelectric Micro-Cooler for Hot-Spot Thermal Management Available to Purchase
Peng Wang,
Peng Wang
University of Maryland, College Park, MD
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Avram Bar-Cohen,
Avram Bar-Cohen
University of Maryland, College Park, MD
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Bao Yang,
Bao Yang
University of Maryland, College Park, MD
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Gary L. Solbrekken,
Gary L. Solbrekken
University of Missouri at Columbia, Columbia, MO
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Yan Zhang,
Yan Zhang
University of California at Santa Cruz, Santa Cruz, CA
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Ali Shakouri
Ali Shakouri
University of California at Santa Cruz, Santa Cruz, CA
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Peng Wang
University of Maryland, College Park, MD
Avram Bar-Cohen
University of Maryland, College Park, MD
Bao Yang
University of Maryland, College Park, MD
Gary L. Solbrekken
University of Missouri at Columbia, Columbia, MO
Yan Zhang
University of California at Santa Cruz, Santa Cruz, CA
Ali Shakouri
University of California at Santa Cruz, Santa Cruz, CA
Paper No:
IPACK2005-73244, pp. 2161-2171; 11 pages
Published Online:
March 4, 2009
Citation
Wang, P, Bar-Cohen, A, Yang, B, Solbrekken, GL, Zhang, Y, & Shakouri, A. "Thermoelectric Micro-Cooler for Hot-Spot Thermal Management." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 2161-2171. ASME. https://doi.org/10.1115/IPACK2005-73244
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