By the development of micro-fabrication technology, much smaller-size electronic devices will be soon available. In such a smaller device, a non-equilibrium state might appear in metal and/or semiconductor. In this case, it is difficult to estimate the device performance by the macroscopic transport equations that assume quasi-equilibrium distribution. We are developing a numerical simulation based on Boltzmann transport equation (BTE), which can analyze thermal and electric phenomena even when the state is far from equilibrium. In this study, we show a new formulation of BTE for free electron in metal and its calculation result: the thermoelectric power obtained agreed with that of experimental value: the heat flux derived by the non-equilibrium distribution was two-orders small than that estimated by thermal conductivity.
Skip Nav Destination
ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Numerical Analysis of Electro-Thermal Phenomena in Metal by Boltzmann Transport Equation for Electron
Ryohei Muramoto,
Ryohei Muramoto
Kyushu University, Fukuoka, Japan
Search for other works by this author on:
Isamu Shiozawa,
Isamu Shiozawa
Kyushu University, Fukuoka, Japan
Search for other works by this author on:
Yasushi Kakimoto,
Yasushi Kakimoto
Kyushu University, Fukuoka, Japan
Search for other works by this author on:
Takashi Masuoka
Takashi Masuoka
Kyushu University, Fukuoka, Japan
Search for other works by this author on:
Kohei Ito
Kyushu University, Fukuoka, Japan
Ryohei Muramoto
Kyushu University, Fukuoka, Japan
Isamu Shiozawa
Kyushu University, Fukuoka, Japan
Yasushi Kakimoto
Kyushu University, Fukuoka, Japan
Takashi Masuoka
Kyushu University, Fukuoka, Japan
Paper No:
IPACK2005-73199, pp. 2103-2107; 5 pages
Published Online:
March 4, 2009
Citation
Ito, K, Muramoto, R, Shiozawa, I, Kakimoto, Y, & Masuoka, T. "Numerical Analysis of Electro-Thermal Phenomena in Metal by Boltzmann Transport Equation for Electron." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 2103-2107. ASME. https://doi.org/10.1115/IPACK2005-73199
Download citation file:
5
Views
Related Proceedings Papers
Related Articles
Heat Generation and Transport in Submicron Semiconductor Devices
J. Heat Transfer (February,1995)
Measurement of the Thermal Conductivity and Heat Capacity of Freestanding Shape Memory Thin Films Using the 3 ω Method
J. Heat Transfer (October,2008)
Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication
J. Electron. Packag (December,2004)
Related Chapters
On Interfacial Ribbons of ζ- and γ-Hydride Phases Surrounding δ Precipitates in Zircaloy-2
Zirconium in the Nuclear Industry: 20th International Symposium
Equilibrium Studies of Ternary Systems Involving Some Selectedtransition Metal Ions, Triazoles and Aromatic Carboxylic Acids
International Conference on Advanced Computer Theory and Engineering, 4th (ICACTE 2011)
Microstructure Evolution and Physics-Based Modeling
Ultrasonic Welding of Lithium-Ion Batteries